Tuesday, August 4, 2009

USB 3.0 to Deliver a Tenfold Speed Increase



Fasten your seat belts — data transfer is going into overdrive.

The ubiquitous Universal Serial Bus, better known as USB, is on track to make its first major upgrade in eight years — a tenfold speed increase over the current USB 2.0 standard. That means we’ll be able to rip music, video, photos from the vast array of peripherals we connect to our computers much more quickly, and it makes such up-and-coming devices as HD video cameras that much more practical.

USB 3.0 will also deliver greater power efficiency and the ability to recharge a wider variety of gadgets — and it will most likely mean the death of the competing standard known as FireWire.

To get a sense of the speed increase, consider this: Under USB 2.0 it takes about 10 minutes to transfer a high-def video from a Blu-ray disc. With USB 3.0, it will take just about a minute.

"What the user will see is really a much faster response time, less waiting, more productivity," says Patrick Moorhead, vice president of advanced marketing at AMD, one of the supporters of the USB 3.0
standard.

But none of this will happen tomorrow. The first USB 3.0 devices probably won’t show up until the end of
2009 or early 2010, say analysts. Users can get a glimpse into future devices sporting SuperSpeed USB as early as the annual Consumer
Electronics Show in January, and Wired.com will be there.

"The first places that you will see this show up is where you get the biggest benefits — HD video cameras and hard drives," says Moorhead.

The USB Implementers Forum, a nonprofit group founded by companies to promote the standard, will announce Monday the final set of specs that will clear the way for the adoption of USB 3.0 by device and component manufacturers.

"USB 3.0 will take USB 2.0 to the next level and take away performance as an issue for data transfer in many devices," says Brian O’Rourke, an analyst with research firm In-Stat. "USB 3.0 will make it even more pervasive across devices than it is today."

Since the USB specification was first introduced in 1996, it has changed the way we interact with our computers. USB has allowed everything from keyboards, mouse, PDAs, printers, digital cameras and personal media players — pretty much the entire spectrum of consumer electronics — to be connected to a host PC using a single standardized socket.

It has also made the process truly plug-and-play. Devices can be connected and disconnected without having to reboot the host computer and the technology offered perks such as allowing for many devices to be charged using the USB socket with no need for individual device drivers to be installed first.

Not surprisingly, USB’s ease of use and capabilities has meant it has become nearly ubiquitous. More than 2.6 billion USB-enabled devices were shipped in 2007, estimates research firm In-Stat.

And USB’s star will continue to rise, says the firm. Nearly four billion USB-enabled devices are expected to ship by 2012. Its ubiquity has meant that some manufacturers use USB ports and plugs for recharging devices such as Bluetooth headsets and phones without utilizing its data-transfer capabilities.

But USB 2.0 is getting a bit long in the tooth, with its slow speed, inefficient power usage and relatively small wattage. The new standard takes aim at all of those shortcomings.

Pour on the Speed

At a glance:USB 3.0
Faster: 10 times faster than USB 2.0 and six times faster than FireWire 800

Greater power efficiency: New interrupt driven protocol optimizes power management.

Better Power Output: Power output bump to 900 milliamps from 100 milliamps allows more devices to be charged faster via USB.

Backward Compatible: New connectors and cables will work with work with devices running the older USB 2.0
The new spec will support data transfers at 4.8 gigabits per second, or Gbps, nearly 10 times faster than the current standard’s 480 megabits per second and six times faster than FireWire 800. It’s also 400 times faster than the 12 Mbps offered by the original spec, USB 1.0.

USB 2.0 is also known as "Hi-Speed USB," while USB 3.0 will have the confusingly similar moniker "SuperSpeed USB."

The new USB 3.0 connectors and devices will be compatible with older USB ports (on devices using USB 2.0 and 1.0) but they will be limited to the older ports’ slower speeds.











Power and Efficiency

USB 2.0 uses a polling-based architecture, which means the host computer has to constantly check the bus to see if any devices are attached and if so, whether they are doing anything. As a result, that keeps the host computer busy, drawing power even when it’s not needed.

"It’s a problem when you attach a USB device to a laptop running on battery," says Steve Kleynhans, vice president, client computing for research firm Gartner.

USB 3.0 offers better specifications for power management. "We will move to an interrupt-driven architecture where your PC can ignore the connected device till the latter actually does something," says Kleynhans. "That can really lower the power consumption."

It also has better power output, 900 milliamps compared to 100 milliamps with USB 2.0. That means up to four devices can be charged from a single USB port and charged faster.


Standardizing the specifications for USB 3.0 hasn’t been easy. Two months ago, Intel released part of the draft specifications for USB 3.0
to developers resolving a dispute between itself, Nvidia and AMD over it.

Nvidia and AMD claimed that Intel was not sharing the specifications that potentially compete with it. Intel denied it.

"There was some debate between us," says Moorhead, "but we have buried the hatchet and we are all in the same boat now."

USB Implementers Forum chairman Jeff Ravencraft declined to be available for comment.

While
USB 3.0 devices are coming soon, consumers won’t immediately see all the benefits. "You can get the USB 3.0 speeds only when one 3.0 device connects to another," says Gartner’s Kleynhans. So the latest SuperSpeed USB-enabled devices connecting to older PCs running USB 2.0 or lower will experience data transfer rates that are much slower.

Killing FireWire

USB 3.0 is likely to signal the death of FireWire/IEEE 1394, a competing interface standard also known as i.Link and Lynx. Today, the industry is bifurcated between IEEE 1394 and USB 2.0. Many devices support both, though a single standard would be optimal.

"If we are all aligned, we are saving money and development time for the industry," says Moorhead.

With
Apple seemingly taking step away from FireWire, it seems like USB could gain the upper hand. Apple’s newly introduced MacBook computers lack a
FireWire port and instead has USB. MacBook Pro still sports FireWire
800.

That leaves Sony as one of the few remaining proponents of the standard.

"FireWire stably declining in most markets and USB 3.0 will continue that trend,"
says O’Rourke. "We could see USB emerge as the standardization of a high-speed interconnect."

Monday’s first USB 3.0 developer conference will be a big step towards that, say experts. "It’s for everyone in the USB value chain, from chipmakers to software makers to learn the new USB standard and get on it," says O’Rourke.

Wired.com

Micron places 16 GB DDR3 on a single module





Micron recently announced that the company has developed a new technology which allows them to place 16 gigabyte of DDR3-memory on a single module. It should also become possible to equip a server with up to nine of these modules, accounting for a total of 144 GB of memory. The so called load-reduced dual-inline memory modules (LRDIMM's) use Micron's 50 nm DDR3-memory chips with a capacity of 2 gigabit a piece. These chips operate at 1,35 V.

Micron reports that the term 'load reduced' means that the server memory will not stress the memory bus as much, allowing for higher data frequencies and capacities. This decreased load is achieved by using an Inphi iMB chip, or isolation memory buffer chip. Compared to the current registered DIMM's, Micron claims a stress-decrease of 50% for dual-rank LRDIMM's and even 75%^for quad-rank modules. Micron also mentions than an LRDIMM has 57% more bandwidth than an RDIMM.

At the moment, Micron is shipping samples of 8 GB LRDIMM-memory to its partners. It's expected that the mass production of 16 GB modules will start in 2010.

Overclocking AMD PhenomTM II Processors to the Limit





Overclocking AMD PhenomTM II Processors to the Limit

PC speed-freaks from across Europe will be pushing their processors to the limit in a series of extreme overclocking trials over the next month. The trials, which have been organised by AMD (NYSE:AMD), will see forum users from 19 leading technology forums from across the continent compete in a series of pedal-to-the-metal contests where they will attempt to push AMD platform technology, codenamed “Dragon,” to the fastest speed possible. During the trials, the contestants will try to clock up the highest scores in categories such as 3D Mark performance, calculation speed and highest CPU clock speed.(i)

The first of these events was held in London on Thursday 23rd April 2009, where sparks flew, literally! In this special event,eight teams of daredevil journalists went head to head in an attempt to break through the sonic wall in 3D Mark05 and CPU clock speeds. Things got so fast and so furious that sparks actually flew from one of the team’s “Dragon” rigs!(i)

It was a closely fought battle, but two winners emerged victorious. Clive Webster from Custom PC won the 3D Mark05 competition with a score of 24,689, while Tim Smally & Rich Swinburne from Bit-Tech won the CPU clock frequency competition with a speed of 4,211MHz. For this special opening event, both winning teams won a prize of $1000 each. The Custom PC donated their winnings to the Phyllis Tuckwell Hospice and the Bit-Tech team gave their winnings to the Myton Hamlet Hospice.
Video to the overclocking event in London

Sunday, August 2, 2009

Intel introduces the new Intel I3







1) The new brand is Intel Core. There will be three derivatives: Core i7, Core i5 and Core i3.

2) The Core 2 Duo and Core 2 Quad branding will eventually disappear.

3) Pentium, Celeron and Atom will remain.

4) Centrino will also go away and Intel's WiFi and WiMAX products will inherit the name starting in 2010.

But what separates a Core i7 from a Core i5 and Core i3? I may have some insight. Let's start with desktop processors:

Desktop Processor
Intel Core i7 Cores: 4 Threads: 8 Turbo: Yes
Intel Core i5 Cores: 2 or 4 Threads: 4 Turbo: Yes
Intel Core i3 Cores: 2 or 4 Threads: 4 Turbo: No

Only the Core i7 is allowed to run in a LGA-1366 socket, however there will be LGA-1156 i7, i5 and i3CPUs . The number of memory channels and the presence of a QPI link does not determine branding. In other words, Lynnfield will be both a Core i7 and a Core i5 depending on the SKU.

The LGA-1156 Core i7s will be the 8xx series, while the LGA-1366 i7s will be the 9xx series. The i5s will be the 6xx series and the i3s will be the 5xx series.

Four cores and HT enabled with turbo mode yields you a Core i7 on the desktop. If you only have support for up to 4 threads then you've got a Core i5; take away turbo and you have a Core i3.

In mobile, things are a little different:

Mobile Processor
Intel Core i7 Cores 2 or 4 Threads 4 or 8 Turbo Yes
Intel Core i5 Cores 2 or 4 Threads 4 Turbo Yes
Intel Core i3 Cores 2 or 4 Threads 4 Turbo No


The mobile i7 can be 2 or 4 cores and support 4 or 8 threads, which makes sense since there will be more dual-core than quad-core mobile processors. The rest of the lineup follows the desktop rules; i5 and i3 are capped at 4 threads and i3 doesn't have Turbo.

Anandtech

AMD Phenom II X4 965 Quad CPU coming in August 2009


AMD is set to launch its fastest quad-core processor around August 2009, the Phenom II X4 965 Black Edition is a new high performance 45 nanometer chip by AMD for desktops.

The Phenom II X965 is made on the AM3 socket clocked at 3.4 GigaHertz and will be the fastest clocked Quad-core processor till date. Intel's fastest quad-core is the Core i7-975 clocked at 3.33 GigaHertz. The chip will contain 2 MegaBytes of L2 cache and 6 MegaBytes of L3 cache.

AMD released its Phenom II X4 chips early this year, click here to view the previous releases.

Phenom II X4 965 Specifications:
Speed: 3.4 GHz
Cores: 4
L2-Cache Size: 2 MB (4x512KB)
L3-Cache Size: 6MB
Hypter Transport speed: 2000 MHz
Socket: AM3
Power TDP: 125 W
Price: N/A


Techiton